MG Chemicals 4900 SAC305 Lead-Free Solder Wire, 0.032 in Dia – No Clean, RoHS Compliant

Overview

MG Chemicals 4900 SAC305 is a lead-free solder wire designed as a no-clean option for modern electronics assembly. With a proven composition of 96.3% tin, 0.7% copper, and 3% silver, this alloy offers RoHS and J-STD-006C compliance while fitting typical workflow needs.

The solder features a flux core that is engineered for steady performance across common reflow conditions. The resin-based flux behaves like a rosin-activated system, promoting fast wetting and a broad spread, while keeping spatter to a minimum. Residues are no-clean for standard applications, reducing post-solder cleaning steps.

Key benefits and practical use

• Excellent wetting action and maximum spreading support reliable joints on compact boards.
• Low spatter due to a specially formulated activator, helping keep workspaces cleaner.
• About 14% longer by weight than typical leaded wires, increasing spool life between changes.

Specifications at a glance

Core specifications include a melting range of 217–221 C (422–430 F) and a recommended upper service limit near 350 C for standard reflow tasks. The wire diameter is 0.032 inches, with a standard gauge around 21 and a tolerance of ±0.002 inches. Density sits at 7.39 g/cc, and tensile strength reaches 4312 psi, reflecting suitable strength for many surface mount and through-hole joints.

Handling and performance notes

• Flux classification ORL0 and minimal cleaning needs align with typical no-clean workflows.
• Residue dryness and flux residue properties support straightforward inspection and maintenance routines.

Whether you are prototyping, performing repairs, or running routine production, MG 4900 offers a lead-free, RoHS-compliant option that integrates smoothly with common soldering practices. For best results, follow standard reflow profiling and consult the full data sheet for complete specs and handling guidelines.