Chip Quik SMD291AX Solder Paste No Clean 63Sn/37Pb (5cc Syringe)

Smart Solder Paste for SMT Assembly and Rework

Chip Quik SMD291AX is a no clean, leaded solder paste designed to support precise, repeatable joints in modern surface mount tasks. Packaged in a compact 5cc syringe with a convenient plunger and tip, it delivers controlled deposits, smooth flow, and reliable wetting across a range of boards and components without demanding aggressive cleaning after work.

The paste features a 63Sn/37Pb alloy and contains about 88 percent metal by weight, a combination that contributes to robust joints and predictable performance under standard reflow profiles. Its particle size, labeled T3 and ranging from 25 to 45 microns, is chosen to balance flow, tackiness, and soldering accuracy while reducing the risk of bridging on small land patterns.

Key characteristics

• No Clean formulation minimizes residue and post-solder cleanup
• Leaded alloy for reliable wetting on many legacy and mixed-technology boards
• Syringe packaging supports clean, repeatable dosing and convenient storage
• 5cc syringe size (approximately 15 g) suits both prototyping and repair workflows

Practical uses and scenarios

Whether you are assembling a fresh board or revisiting a stubborn joint, SMD291AX offers a dependable option. The paste’s consistency supports precise dot deposition and even spreading, which helps you manage tight patterns and small components with confidence. The no-clean formula minimizes the need for heavy cleaning, while the leaded composition can improve wetting behavior on a variety of solderable surfaces—useful for mixed-technology assemblies or quick revisions during development cycles.

• Rework on dense SMT footprints with tight pitch
• Prototype assembly and rapid iteration on small components
• Touch-ups on boards with challenging land patterns
• Consistent deposits during stencil or manual application

Tips for best results

Store the syringe sealed and in a suitable temperature range between uses. Use the plunger to load a small amount for each pad, then apply with steady pressure to achieve a clean, even bead before reflow. Align with your standard reflow profile and inspect joints for a bright, smooth finish.